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Demonstration project of an electronics enclosure using CHT v2. Comparison different passive heat sink designs and comparison of active and passive cooling

Demo of cooling of Raspberry Pi using the Immersed Boundary Method (IBM). 
IBM makes CAD cleanup and defeaturing obsolete. A CAD with detailed electronic features (pins, connectors, engravings, etc.) can be directly imported as is for simulation
In this demo a Raspberry Pi is overclocked and the heat transfer behaviour is compared for two cases where the fan is off and on.

Internal Natural Convection Electronics Cooling Demo 2

LED Spotlight project, aiming to bring the temperature of the diodes of an LED spotlight design below the maximum allowed temperature of the diodes of 90C. Comparison of different heat sink designs

natural convection cooling of a thermoelectric generator setup with heatplate including radiation

Electronics packaging with forced cooling. Find the best location for the fan, outlet ventilation locations etc.

Thermal analysis of cooling system for solar panels

Aim to show electronics cooling and airflow inside a Stewart platform.

Carry out conjugate heat transfer analysis with 2021 battery segment including busbars. The goal is to find the size the fan by finding the right air flow rate to keep cell temperature in check

Testing out a CPU cooler with a copper Vapor Chamber and Copper HeatSink

This simulation aims a determining whether the temperature of the board of 2x 160W COB Series UV LED is below the recommended temperature of 40C  with a water cooling block running with 0.2m/s inlet velocity.

3D model from Philippe Cavalier (https://grabcad.com/library/water-cooling-led-heatsink-1)

Thermal simulation of electronics in a housing.

This project simulates a solid-state relay under a 15W heat load. 
This relay includes a heat sink that acts as a fixture from the relay housing to the mounting wall. The product is tested under natural convection conditions at 20C. 

Credits to Xinchao Song for the 3D model used in this project.  Link : https://tinyurl.com/ycd6cvug

To impart cooling to the electronic components

Calculate the Fin thickness and heat dissipation

Calculate the area and Fin thickness required heat dissipation

Thermal analysis of an active heatsink to cool a microprocessor

Conjugate heat transfer simulation to analyse the thermal performance of water cooled transistors.

LED Spotlight project, aiming a bring the temperature of the diodes of a LED spotlight design below the maximum allowed temperature of 100C.

This project deals with simulating the flow through the graphic card at different fan Rpms using the Multiple reference frame(MRF) rotational zone concept. A conjugate heat transfer analysis will be performed to keep a check on thermal throttling of the GPU.

Setup of Heatsink Simulation for comparison to fusion electronic cooling.

The goal of this project is to simulate the simplified version of the cooling system of the HP Workstation Notebook.
This is a Conjugate Heat Transfer (CHT) problem. Incompressible turbulent flow was assigned for the air flow. Two cooling scenarios are going to be investigated
1- Current cooling system 
2- External cooling fan assisted system

Electric panel-cabinet cooling analysis via CHT

The presented project is an analysis of the thermal performance of a heat sink connected to chip. The chip acts as a power source generating 30W of heat. Using a conjugate heat transfer analysis allows for simulation of heat transfer between the solids via conduction and the dissipation of heat into the ambient fluid via convection. The components are cooled passively and buoyancy effects  drive the flow in the surrounding air.

The objective of this project is to evaluate the max temperature of the chip during operation and therefore a steady state analysis was carried out.

Simulation of led pcb heat sink
thermal description
led thermal management system

CFD Cooling electronics inside of cabinet

electronics cooling | SimScale Project Library | Page 1